Jan. 21, 2026, 4:30 p.m.
Chinese semiconductor industry gears up for domestic HBM3 production by the end of 2026 — CXMT to produce chips, while Naura, Maxwell, and U-Preseason design tools for assembly
Chinese semiconductor industry is working to localize production of HBM3 memory, in addition to the tools required for HBM assembly. However, the exact progress of these projects is unknown.
Chinese semiconductor industry gears up for domestic HBM3 production by the end of 2026 — CXMT to produce chips, while Naura, Maxwell, and U-Preseason design tools for assembly
Chinese semiconductor industry is working to localize production of HBM3 memory, in addition to the tools required for HBM assembly. However, the exact progress of these projects is unknown.